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? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c108 7_u2j_ft-cap_smd ? 6/7/2016 1 overview kemets flexible termination (ft-cap) multilayer ceramic capacitor in u2j dielectric incorporates a unique, fexible termination system that is integrated with kemets standard termination materials. a conductive silver epoxy is utilized between the base metal and nickel barrier layers of kemets standard termination system in order to establish pliability while maintaining terminal strength, solderability and electrical performance. this technology was developed in order to address the primary failure mode of mlccsfex cracks, which are typically the result of excessive tensile and shear stresses produced during board fexure and thermal cycling. flexible termination technology inhibits the transfer of board stress to the rigid ceramic body, therefore mitigating fex cracks which can result in low ir or short circuit failures. although this technology does not eliminate the potential for mechanical damage that may propagate during extreme environmental and handling conditions, it does provide superior fex performance over standard termination systems. ft-cap complements kemets open mode, floating electrode (fe-cap), floating electrode with flexible termination (ff-cap), and kemet power solutions (kps) product lines by providing a complete portfolio of fex mitigation solutions. combined with the stability of u2j dielectric and designed to accommodate all capacitance requirements, these fex-robust devices are roh compliant, offer up to 5 mm of fex-bend capability and capacitance change limited to ?750 120ppm/c from ?55c to +125c. these devices are lead-free, rohs and reach compliant without exception and are capable of withstanding multiple passes through a lead-free solder refow profle. surface mount multilayer ceramic chip capacitors (smd mlccs) flexible termination system (ft-cap), u2j dielectric, 10 - 50 vdc (commercial grade) ordering information c 1206 x 104 j 3 j a c tu ceramic case size (l" x w") specifcation/ two signifcant digits + number of zeros. f = 1% g = 2% j = 5% k = 10% m = 20% 8 = 10 4 = 16 3 = 25 5 = 50 j = u2j a = n/a c = 100% matte sn 1 additional capacitance tolerance offerings may be available. contact kemet for details. one world. one kemet preliminary data sheet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c108 7_u2j_ft-cap_smd ? 6/7/2016 2 packaging c-spec ordering options table packaging type 1 packaging/grade ordering code (c-spec) bulk bag/unmarked not required (blank) 7" reel/unmarked tu 13" reel/unmarked 7411 (eia 0603 and smaller case sizes) 7210 (eia 0805 and larger case sizes) 7" reel/unmarked / 2 mm pitch 2 7081 13" reel/unmarked / 2 mm pitch 2 7082 1 default packaging is bulk bag. an ordering code c-spec is not required for bulk bag packaging. 1 the terms marked and unmarked pertain to laser marking option of capacitors. all packaging options labeled as unmarked will contain capacitors that have not been laser marked. the option to laser mark is not available on these devices. for more information see capacitor marking. 2 the 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. this option is limited to eia 0603 (1608 metric) case size devices. for more information regarding 2 mm pitch option see tape & reel packaging information. benefts operating temperature range of 55c to 25c ? lead ( pb)-free, rohs and reach compliant ? eia 06 03, 0805, 1206, 1210 and 1812 case sizes ? dc vol tage ratings of 10 v, 16 v, 25 v and 50 v ? capac itance offerings ranging from 1.0 nf up to 470 nf ydl odeohfdsdflwdqfhwrohudqfhvridqg ? low no ise solution similar to c0g /rzgl vvlsdwlrqidfwru') ? low es r & esl ? high t hermal stability ? high r ipple current capability ? pref erred capacitance solution at line frequencies & into the mhz range ? small predictable and linear capacitance change with respect to temperature ? non- polar device, minimizing installation concerns s xuhpdwwh7lqsodwhgwhuplqdwlrqqlvkdoorzlqjiruhfhoohqwvroghudelolw 5hwd lqvriqrplqdofdsdflwdqfhdwixooudwhgyrowdjh applications typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling, bypass, owhulqjwudqvlhqwyrowdjhvxssuhvvlrqdqgeorfnlqjdvzhoodvhqhujvwrudjhlqfulwlfdodqgvdihwuhohydqwflufxlwvzlwkrxwlqwhjudwhg fxuuhqwolplwdwlrqlqfoxglqjwkrvhvxemhfwwrkljkohyhovrierdughxuhruwhpshudwxuhffolqj surface mount multilayer ceramic chip capacitors (smd mlccs) flexible termination system (ft-cap), u2j dielectric, 10 - 50 vdc (commercial grade) preliminary data sheet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c108 7_u2j_ft-cap_smd ? 6/7/2016 3 dimensions C millimeters (inches) l b w s t eia size code metric size code l length w width t thickness b bandwidth s separation minimum mounting technique 0603 1608 1.60 (0.063)0.17 (0.007) 0.80 (0.032)0.15 (0.006) see table 2 for thickness 0.45 (0.018)0.15 (0.006) 0.58 (0.023) solder wave or solder refow 0805 2012 2.00 (0.079)0.30 (0.012) 1.25 (0.049)0.30 (0.012) 0.50 (0.02)0.25 (0.010) 0.75 (0.030) 1206 3216 3.30 (0.130)0.40 (0.016) 1.60 (0.063)0.35(0.013) 0.60 (0.024)0.25 (0.010) n/a 1210 3225 3.30 (0.130)0.40 (0.016) 2.60(0.102)0.30(0.012) 0.60 (0.024)0.25 (0.010) solder refow only 1812 4532 4.50 (0.178)0.40 (0.016) 3.20 (0.126)0.30 (0.012) 0.70 (0.028)0.35 (0.014) ualifcation/certifcation commercial grade products are subject to internal qualifcation. details regarding test methods and conditions are referenced in table 4, performance & reliability. environmental compliance lead (pb)-free, rohs, and reach compliant without exemptions. surface mount multilayer ceramic chip capacitors (smd mlccs) flexible termination system (ft-cap), u2j dielectric, 10 - 50 vdc (commercial grade) preliminary data sheet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c108 7_u2j_ft-cap_smd ? 6/7/2016 4 electrical parameters/characteristics item parameters/characteristics operating temperature range ?55c to +125c capacitance change with reference to +25c and 0 vdc applied (tcc) ?750 12030 ppm/oc aging rate (maximum % capacitance loss/decade hour) 0.1% dielectric withstanding voltage (dwv) 250% of rated voltage (5 1 seconds and charge/discharge not exceeding 50 ma) dissipation factor (df) maximum limit at 25oc 0.1% insulation resistance (ir) limit at 25c 1,000 megohm microfarads or 100 g (rated voltage applied for 120 5 seconds at 25c) t o obtain ir limit, divide m-f value by the capacitance and compare to g limit. select the lower of the two limits. capacitance and dissipation factor (df) measured under the following conditions: 1 mhz 1 00 khz and 1.0 vrms 0.2 v if capacitance 1,000 pf 1 khz 5 0 hz and 1.0 vrms 0.2 v if capacitance > 1,000 pf note: when measuring capacitance it is important to ensure the set voltage level is held constant. the hp4284 and agilent e4980 have a feature known as automatic level control (alc). the alc feature should be switched to "on." post environmental limits high temperature life, biased humidity, moisture resistance dielectric rated dc voltage capacitance value dissipation factor (maximum %) capacitance shift insulation resistance u2j all all 0.5 0.3% or 0.25 pf 10% of initial limit surface mount multilayer ceramic chip capacitors (smd mlccs) flexible termination system (ft-cap), u2j dielectric, 10 - 50 vdc (commercial grade) preliminary data sheet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c10 87_u2j_ft-cap_smd ? 6/7/2016 5 table 1a C capacitance range/selection waterfall (0603 C 1812 case sizes) capacitance cap code case size/ series c0603x c0805x c1206x c1210x c1812x voltage code 8 4 3 5 8 4 3 5 8 4 3 5 8 4 3 5 8 4 3 5 rated voltage (vdc) 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 capacitance tolerance product availability and chip thickness codes see table 2 for chip thickness dimensions 100 pf 101 f g j k m 110 pf 111 f g j k m 120 pf 121 f g j k m 130 pf 131 f g j k m 150 pf 151 f g j k m 160 pf 161 f g j k m 180 pf 181 f g j k m 200 pf 201 f g j k m 220 pf 221 f g j k m 240 pf 241 f g j k m 270 pf 271 f g j k m 300 pf 301 f g j k m 330 pf 331 f g j k m 360 pf 361 f g j k m 390 pf 391 f g j k m 430 pf 431 f g j k m 470 pf 471 f g j k m 510 pf 511 f g j k m 560 pf 561 f g j k m 620 pf 621 f g j k m 680 pf 681 f g j k m 750 pf 751 f g j k m 820 pf 821 f g j k m 910 pf 911 f g j k m 1,000 pf 102 f g j k m cf cf cf cf 1,100 pf 112 f g j k m cf cf cf cf 1,200 pf 122 f g j k m cf cf cf cf 1,300 pf 132 f g j k m cf cf cf cf 1,500 pf 152 f g j k m cf cf cf cf 1,600 pf 162 f g j k m cf cf cf cf 1,800 pf 182 f g j k m cf cf cf cf 2,000 pf 202 f g j k m cf cf cf cf 2,200 pf 222 f g j k m cf cf cf cf 2,400 pf 242 f g j k m cf cf cf cf 2,700 pf 272 f g j k m cf cf cf cf 3,000 pf 302 f g j k m cf cf cf cf 3,300 pf 332 f g j k m cf cf cf cf 3,600 pf 362 f g j k m cf cf cf cf 3,900 pf 392 f g j k m cf cf cf cf 4,300 pf 432 f g j k m cf cf cf cf 4,700 pf 472 f g j k m cf cf cf cf dc dc dc dc 5,100 pf 512 f g j k m cf cf cf cf dc dc dc dc 5,600 pf 562 f g j k m cf cf cf cf dc dc dc dc 6,200 pf 622 f g j k m cf cf cf cf dc dc dc dc 6, 8 00 pf 682 f g j k m cf cf cf cf dc dc dc dc 7,50 0 pf 752 f g j k m cf cf cf cf dc dc dc dc 8,200 pf 822 f g j k m cf cf cf cf dc dc dc dc 9,100 pf 912 f g j k m cf cf cf cf dc dc dc dc 10,000 pf 103 f g j k m cf cf cf cf dc dc dc dc eb eb eb eb fb fb fb fb 12,000 pf 123 f g j k m cf cf cf dc dc dc dc eb eb eb eb fb fb fb fb 15,000 pf 153 f g j k m cf cf cf dc dc dc dc eb eb eb eb fb fb fb fb capacitance cap code rated voltage (vdc) 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 voltage code 8 4 3 5 8 4 3 5 8 4 3 5 8 4 3 5 8 4 3 5 case size/series c0603x c0805x c1206x c1210x c1812x surface mount multilayer ceramic chip capacitors (smd mlccs) flexible termination system (ft-cap), u2j dielectric, 10 - 50 vdc (commercial grade) preliminary data sheet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c10 87_u2j_ft-cap_smd ? 6/7/2016 6 table 1a C capacitance range/selection waterfall (0603 C 1812 case sizes) cont'd . capacitance cap code case size/ series c0603x c0805x c1206x c1210x c1812x voltage code 8 4 3 5 8 4 3 5 8 4 3 5 8 4 3 5 8 4 3 5 rated voltage (vdc) 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 capacitance tolerance product availability and chip thickness codes see table 2 for chip thickness dimensions 18,000 pf 183 f g j k m dc dc dc dc eb eb eb eb fb fb fb fb 22,000 pf 223 f g j k m dc dc dc dd eb eb eb eb fb fb fb fb 27,000 pf 273 f g j k m dd dd dd dd eb eb eb eb fb fb fb fb 33,000 pf 333 f g j k m dd dd dd dg eb eb eb eb fb fb fb fb gb gb gb 47,000 pf 393 f g j k m dg dg dg dg eb eb eb eb fb fb fb fb gb gb gb 47,000 pf 473 f g j k m dg dg dg dg eb eb eb eb fb fb fb fb gb gb gb 56,000 pf 563 f g j k m eb eb eb ec fb fb fb fb gb gb gb 68,000 pf 683 f g j k m ec ec ec ec fb fb fb fb gb gb gb 82,000 pf 823 f g j k m ec ec ec ee fb fb fb fb gb gb gb 100,000 pf 104 f g j k m ec ec ec ef fb fb fb fc gb gb gb 120,000 pf 124 f g j k m ef ep ef eh fc fc fc fe gb gb gb 150,000 pf 154 f g j k m ef ef ef eh fe fe fe fg gb gb gb 180,000 pf 184 f g j k m eh eh eh fg fg fg fg gb gb gb 220,000 pf 224 f g j k m eh eh eh fg fg fg fh gb gb gb 270,000 pf 274 f g j k m fh fh fh fm gb gb gb 330,000 pf 334 f g j k m fm fm fm gc gc gc 390,000 pf 394 f g j k m gh gh gh 470,000 pf 474 f g j k m gk gk gk capacitance cap code rated voltage (vdc) 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 voltage code 8 4 3 5 8 4 3 5 8 4 3 5 8 4 3 5 8 4 3 5 case size/series c0603x c0805x c1206x c1210x c1812x surface mount multilayer ceramic chip capacitors (smd mlccs) flexible termination system (ft-cap), u2j dielectric, 10 - 50 vdc (commercial grade) preliminary data sheet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c10 87_u2j_ft-cap_smd ? 6/7/2016 7 table 2a C chip thickness/tape & reel packaging quantities thickness code case size 1 thickness range (mm) paper quantity 1 plastic quantity 7" reel 13" reel 7" reel 13" reel cj 0603 0.80 0.15 4,000 15,000 0 0 ch 0603 0.85 0.07 4,000 10,000 0 0 dr 0805 0.78 0.20 0 0 4,000 10,000 dd 0805 0.90 0.10 0 0 4,000 10,000 ds 0805 1.00 0.20 0 0 2,500 10,000 df 0805 1.10 0.10 0 0 2,500 10,000 dg 0805 1.25 0.15 0 0 2,500 10,000 eq 1206 0.78 0.20 4,000 10,000 4,000 10,000 er 1206 0.90 0.20 0 0 4,000 10,000 es 1206 1.00 0.20 0 0 2,500 10,000 et 1206 1.10 0.20 0 0 2,500 10,000 ef 1206 1.20 0.15 0 0 2,500 10,000 eh 1206 1.60 0.20 0 0 2,000 8,000 fn 1210 0.78 0.20 0 0 4,000 10,000 fq 1210 0.90 0.20 0 0 4,000 10,000 fe 1210 1.00 0.10 0 0 2,500 10,000 fa 1210 1.10 0.15 0 0 2,500 10,000 fz 1210 1.25 0.20 0 0 2,500 10,000 fu 1210 1.55 0.20 0 0 2,000 8,000 fm 1210 1.70 0.20 0 0 2,000 8,000 fj 1210 1.85 0.20 0 0 2,000 8,000 fk 1210 2.10 0.20 0 0 2,000 8,000 gb 1812 1.00 0.10 0 0 1,000 4,000 gd 1812 1.25 0.15 0 0 1,000 4,000 gh 1812 1.40 0.15 0 0 1,000 4,000 gg 1812 1.55 0.10 0 0 1,000 4,000 gk 1812 1.60 0.20 0 0 1,000 4,000 gj 1812 1.70 0.15 0 0 1,000 4,000 gn 1812 1.70 0.20 0 0 1,000 4,000 gm 1812 2.00 0.20 0 0 500 2,000 thickness code case size 1 thickness range (mm) 7" reel 13" reel 7" reel 13" reel paper quantity 1 plastic quantity package quantity based on fnished chip thickness specifcations. surface mount multilayer ceramic chip capacitors (smd mlccs) flexible termination system (ft-cap), u2j dielectric, 10 - 50 vdc (commercial grade) preliminary data sheet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c10 87_u2j_ft-cap_smd ? 6/7/2016 8 table 2b C bulk packaging quantities packaging type loose packaging bulk bag (default) packaging c-spec 1 n/a 2 case size packaging quantities (pieces/unit packaging) eia (in) metric (mm) minimum maximum 0603 1608 1 50,000 0805 2012 1206 3216 1210 3225 1812 4532 20,000 1 the "packaging c-spec" is a 4 to 8 digit code which identifes the packaging type and/or product grade. when ordering, the proper code must be included in the 15th through 22nd character positions of the ordering code. see "ordering information" section of this document for further details. commercial grade product ordered without a packaging c-spec will default to our standard "bulk bag" packaging. contact kemet if you require a bulk bag packaging option for automotive grade products. 2 a packaging c-spec (see note 1 above) is not required for "bulk bag" packaging (excluding anti-static bulk bag and automotive grade products). the 15th through 22nd character positions of the ordering code should be left blank. all product ordered without a packaging c-spec will default to out standard "bulk bag" packaging. surface mount multilayer ceramic chip capacitors (smd mlccs) flexible termination system (ft-cap), u2j dielectric, 10 - 50 vdc (commercial grade) preliminary data sheet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c10 87_u2j_ft-cap_smd ? 6/7/2016 9 table 3 C chip capacitor land pattern design recommendations per ipcC7351 (mm) eia size code metric size code density level a: maximum (most) land protrusion (mm) density level b: median (nominal) land protrusion (mm) density level c: minimum (least) land protrusion (mm) c y x v1 v2 c y x v1 v2 c y x v1 v2 0603 1608 0.85 1.25 1.10 4.00 2.10 0.75 1.05 1.00 3.10 1.50 0.65 0.85 0.90 2.40 1.20 0805 2012 0.99 1.44 1.66 4.47 2.71 0.89 1.24 1.56 3.57 2.11 0.79 1.04 1.46 2.42 1.81 1206 3216 1.59 1.62 2.06 5.85 3.06 1.49 1.42 1.96 4.95 2.46 1.39 1.22 1.86 4.25 2.16 1210 3225 1.59 1.62 3.01 5.90 4.01 1.49 1.42 2.91 4.95 3.41 1.39 1.22 2.81 4.25 3.11 1812 4532 2.10 1.80 3.60 7.0 0 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70 density level a: for low-density product applications. recommended for wave solder applications and provides a wider process window for refow solder density level b: for products with a moderate level of component density. provides a robust solder attachment condition for refow solder processes. density level c: for high component density product applications. before adapting the minimum land pattern variations the user should perform qualifcation y c c x x v1 v2 grid placement courtyard y surface mount multilayer ceramic chip capacitors (smd mlccs) flexible termination system (ft-cap), u2j dielectric, 10 - 50 vdc (commercial grade) preliminary data sheet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c10 87_u2j_ft-cap_smd ? 6/7/2016 10 soldering process recommended soldering technique: ? sold er wave or solder refow for eia case sizes 0603, 0805 and 1206 ? all o ther eia case sizes are limited to solder refow only recommended refow soldering profle: kemets families of surface mount multilayer ceramic capacitors (smd mlccs) are compatible with wave (single or dual), convection, ir or vapor phase refow techniques. preheating of these components is recommended to avoid extreme thermal stress. kemet s recommended profle conditions for convection and ir refow refect the profle conditions of the ipc/j-std-020 standard for moisture sensitivity testing. these devices can safely withstand a maximum of three refow passes at these conditions. profle feature termination finish snpb 100% matte sn preheat/soak temperature minimum (t smin ) & & temperature maximum (t smax ) 150c 200c time (t s ) from t smin to t smax 60 C 120 seconds 60 C 120 seconds ramp-up rate (t l to t p ) 3c/second maximum 3c/second maximum liquidous temperature (t l ) 183c 217c time above liquidous (t l ) 60 C 150 seconds 60 C 150 seconds peak temperature (t p ) 235c 260c time within 5c of maximum peak temperature (t p ) 20 seconds maximum 30 seconds maximum ramp-down rate (t p to t l ) 6c/second maximum 6c/second maximum time 25c to peak temperature 6 minutes maximum 8 minutes maximum note 1: all temperatures refer to the center of the package, measured on the fdsdflwruervuidfhwkdwlvidflsuldvvhpeouhr time temperature t smin 25 c to peak t l t s 25 t p t smax t l t p maximum ramp up rate = 3 c/sec maximum ramp down rate = 6 c/sec surface mount multilayer ceramic chip capacitors (smd mlccs) flexible termination system (ft-cap), u2j dielectric, 10 - 50 vdc (commercial grade) preliminary data sheet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c10 87_u2j_ft-cap_smd ? 6/7/2016 11 table 4 C performance & reliability: test methods and conditions stress reference test or inspection method terminal strength jisCcC6429 appendix 1, note: board flex jisCcC6429 appendix 2, note: 3.0 mm (minimum). solderability jCstdC002 magnifcation 50 x conditions: a) method b, 4 hours at 155c, dry heat at 235c b) method b at 215c category 3 c) method d, category 3 at 260c temperature cycling jesd22 method ja-104 1,000 cycles (?55c to +125c). measurement at 24 hours +/? 4 hours after test conclusion. biased humidity mil-std-202 method 103 load humidity: 1,000 hours 85c/85% rh and rated voltage. add 100 k ohm resistor. measurement at 24 hours +/? 4 hours after test conclusion. low volt humidity: 1,000 hours 85c/85% rh and 1.5 v. add 100 k ohm resistor. measurement at 24 hours +/? 4 hours after test conclusion. t = 24 hours/cycle. steps 7a & 7b not required. measurement at 24 hrs. +/? 4 hours after test conclusion. thermal shock mil-std-202 method 107 ?55c/+125c. note: number of cycles required C 300. maximum transfer time C 20 seconds. dwell time C 15 minutes. air C air. high temperature life mil-std-202 method 108/eia -198 1,000 hours at 125c with 2 x rated voltage applied. storage life mil-std-202 method 108 125c, 0 vdc for 1,000 hours. vibration mil-std-202 method 204 5 g's for 20 minutes, 12 cycles each of 3 orientations. note: use 8" x 5" pcb 0.031" thick 7 secure points on one long side and 2 secure points at corners of opposite sides. parts mounted within 2" from any secure point. test from 10 C 2,000 hz mechanical shock mil-std-202 method 213 figure 1 of method 213, condition f. resistance to solvents mil-std-202 method 215 add aqueous wash chemical, okem clean or equivalent. storage and handling ceramic chip capacitors should be stored in normal working environments. while the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. in addition, packaging materials will be degraded by high temperatureC reels may soften or warp and tape peel force may increase. kemet recommends that maximum storage temperature not exceed 40oc and maximum storage humidity not exceed 70% relative humidity. temperature fuctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. for optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. package size (l" x w") force duration 0402 5 n (0.51 kg) 60 seconds 0603 10 n (1.02 kg) 0805 surface mount multilayer ceramic chip capacitors (smd mlccs) flexible termination system (ft-cap), u2j dielectric, 10 - 50 vdc (commercial grade) preliminary data sheet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c10 87_u2j_ft-cap_smd ? 6/7/2016 12 construction dielectric material (cazro 3 ) detailed cross section inner electrodes (ni) barrier layer (ni) termination finish (100% matte sn / snpb - 5% pb min) inner electrodes (ni) dielectric material (cazro 3 ) epoxy layer (ag) end termination/ external electrode (cu) barrier layer (ni) termination finish (100% matte sn / snpb - 5% pb min) epoxy layer (ag) end termination/ external electrode (cu) capacitor marking (optional): laser marking option is not available on: ? c0g , ultra stable x8r and y5v dielectric devices ? eia 0 402 case size devices ? eia 0 603 case size devices with flexible termination option. ? kps c ommercial and automotive grade stacked devices. these capacitors are supplied unmarked only. surface mount multilayer ceramic chip capacitors (smd mlccs) flexible termination system (ft-cap), u2j dielectric, 10 - 50 vdc (commercial grade) preliminary data sheet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c10 87_u2j_ft-cap_smd ? 6/7/2016 13 tape & reel packaging information kemet offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with eia standard 481. this packaging system is compatible with all tape-fed automatic pick and place systems. see table 2 for details on reeling quantities for commercial chips. 8 mm, 12 mm or 16 mm carrier tape 178 mm (7.00") or 330 mm (13.00") anti-static reel embossed plastic* or punched paper carrier. embossment or punched cavity anti-static cover tape (.10 mm (.004") maximum thickness) chip and kps orientation in pocket (except 1825 commercial, and 1825 and 2225 military) *eia 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. kemet ? bar code label sprocket holes table 5 C carrier tape conf guration, embossed plastic & punched paper (mm) eia case size tape size (w)* embossed plastic punched paper 7" reel 13" reel 7" reel 13" reel pitch (p 1 )* pitch (p 1 )* 01005 C 0402 8 2 2 0603 8 2/4 2/4 0805 8 4 4 4 4 1206 C 1210 8 4 4 4 4 1805 C 1808 12 4 4 1812 12 8 8 kps 1210 12 8 8 kps 1812 & 2220 16 12 12 array 0508 & 0612 8 4 4 *refer to figures 1 & 2 for w and p 1 carrier tape reference locations. 5hihuwr7deohviruwrohudfhvshflfdwlrv new 2 mm pitch reel options* packaging ordering code (c-spec) packaging type/options c-3190 automotive grade 7" reel unmarked c-3191 automotive grade 13" reel unmarked c-7081 commercial grade 7" reel unmarked c-7082 commercial grade 13" reel unmarked * 2 mm pitch reel only available for 0603 eia case size. 2 mm pitch reel for 0805 eia case size under development. benef ts of changing from 4 mm to 2 mm pitching spacing ? lower placement costs ? double the parts on each reel results in fewer reel changes and increased eff ciency ? fewer reels result in lower packaging, shipping and storage costs, reducing waste surface mount multilayer ceramic chip capacitors (smd mlccs) flexible termination system (ft-cap), u2j dielectric, 10 - 50 vdc (commercial grade) preliminary data sheet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c10 87_u2j_ft-cap_smd ? 6/7/2016 14 figure 1 C embossed (plastic) carrier tape dimensions po t f w cent er line s of ca vity ao bo user direction of unre elin g cover tape ko b 1 is for tape feeder reference only, including dra ft concentric abou t b o . t 2 ?d 1 ?do b 1 s 1 t 1 e 1 e 2 p 1 p 2 embossment for c avity size, see note 1 table 4 [10 pitches cumulative tolerance on tape 0.2 mm] table 6 ? embossed (plastic) carrier tape dimensions metric will govern constant dimensions millimeters (inches) tape size d 0 d 1 minimum note 1 e 1 p 0 p 2 r reference note 2 s 1 minimum note 3 t maximum t 1 maximum 8 mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) 1.0 (0.039) 25.0 (0.984) 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) 12 mm 1.5 (0.059) 30 (1.181) 16 mm variable dimensions millimeters (inches) tape size pitch b 1 maximum note 4 e 2 minimum f p 1 t 2 maximum w maximum a 0 ,b 0 & k 0 8 mm single (4 mm) 4.35 (0.171) 6.25 (0.246) 3.5 0.05 (0.138 0.002) 4.0 0.10 (0.157 0.004) 2.5 (0.098) 8.3 (0.327) note 5 12 mm single (4 mm) & double (8 mm) 8.2 (0.323) 10.25 (0.404) 5.5 0.05 (0.217 0.002) 8.0 0.10 (0.315 0.004) 7.5 0.05 (0.138 0.002) 12.0 0.10 (0.157 0.004) 1. the embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. dimensions of embossment location and hole location shall be applied independent of each other. 2. the tape with or without components shall pass around r without damage (see figure 6). 3. if s 1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see eia standard 481 paragraph 4.3 section b). 4. b 1 dimension is a reference dimension for tape feeder clearance only. 5. the cavity def ned by a 0 , b 0 and k 0 shall surround the component with suff cient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20 maximum for 8 and 12 mm tapes and 10 maximum for 16 mm tapes (see figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see figure 4). (e) for kps series product, a 0 and b 0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see addendum in eia standard 481 for standards relating to more precise taping requirements. surface mount multilayer ceramic chip capacitors (smd mlccs) flexible termination system (ft-cap), u2j dielectric, 10 - 50 vdc (commercial grade) preliminary data sheet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c10 87_u2j_ft-cap_smd ? 6/7/2016 15 figure 2 C punched (paper) carrier tape dimensions user direct ion of unr eeli ng top cover t ape t center li nes o f cavity p 1 ?do po p 2 e 1 f e 2 w g a 0 b 0 cavity size, see n ote 1, tab le 7 bottom cover tape t 1 t 1 bottom cover tape [10 pitc he s cumulative tolerance on tape 0.2 mm] table 7 ? punched (paper) carrier tape dimensions metric will govern constant dimensions millimeters (inches) tape size d 0 e 1 p 0 p 2 t 1 maximum g minimum r reference note 2 8 mm 1.5 +0.10 -0.0 (0.059 +0.004 -0.0) 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 0.10 (0.004) maximum 0.75 (0.030) 25 (0.984) variable dimensions millimeters (inches) tape size pitch e2 minimum f p 1 t maximum w maximum a 0 b 0 8 mm half (2 mm) 6.25 (0.246) 3.5 0.05 (0.138 0.002) 2.0 0.05 (0.079 0.002) 1.1 (0.098) 8.3 (0.327) note 1 8 mm single (4 mm) 4.0 0.10 (0.157 0.004) 1. the cavity def ned by a 0 , b 0 and t shall surround the component with suff cient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20 maximum (see figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see figure 4). e) see addendum in eia standard 481 for standards relating to more precise taping requirements. 2. the tape with or without components shall pass around r without damage (see figure 6). surface mount multilayer ceramic chip capacitors (smd mlccs) flexible termination system (ft-cap), u2j dielectric, 10 - 50 vdc (commercial grade) preliminary data sheet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c10 87_u2j_ft-cap_smd ? 6/7/2016 16 packaging information performance notes 1. cover tape break force: 1.0 kg minimum. 2. cover tape peel strength: the total peel strength of the cover tape from the carrier tape shall be: tape width peel strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf) the direction of the pull shall be opposite the direction of the carrier tape travel. the pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. during peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 10 mm/minute. 3. labeling: bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. refer to eia standards 556 and 624 . figure 3 C maximum component rotation ao bo t s max imum c ompon en t rota ti on t op view maxi mum co mponent rotat ion s id e view tape m ax imum width (mm) r otat io n ( t ) 8,12 20 16 ? 200 10 tap e m aximum wid th ( mm) ro tat ion ( s ) 8,12 20 16 ? 56 10 72 ? 200 5 typical pocke t cente r line typical com po nent centerline figure 4 C maximum lateral movement 0.5 mm maxi mum 0.5 mm maxi mum 8 mm & 1 2 mm tape 1.0 mm maxi mum 1.0 mm maxi mum 1 6 mm tape figure 5 C bending radius r r b en ding radius e mbo ssed carrier p unc hed ca rrier surface mount multilayer ceramic chip capacitors (smd mlccs) flexible termination system (ft-cap), u2j dielectric, 10 - 50 vdc (commercial grade) preliminary data sheet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c10 87_u2j_ft-cap_smd ? 6/7/2016 17 figure 6 C reel dimensions a d (see note) full radi us, see note b (see note) access hole at slot location (? 40 mm minimum) if present, tape slot in core for t ap e start: 2.5 mm minimum width x 10.0 mm minimum depth w 3 (includes flange distortion at outer edge) w 2 (m ea sured at hu b) w 1 (m ea sured at hu b) c (arbor hole diameter) note: drive spokes optional; if used, dimensions b and d shall apply. n table 8 ? reel dimensions metric will govern constant dimensions millimeters (inches) tape size a b minimum c d minimum 8 mm 178 0.20 (7.008 0.008) or 330 0.20 (13.000 0.008) 1.5 (0.059) 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) 20.2 (0.795) 12 mm 16 mm variable dimensions millimeters (inches) tape size n minimum w 1 w 2 maximum w 3 8 mm 50 (1.969) 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) surface mount multilayer ceramic chip capacitors (smd mlccs) flexible termination system (ft-cap), u2j dielectric, 10 - 50 vdc (commercial grade) preliminary data sheet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c10 87_u2j_ft-cap_smd ? 6/7/2016 18 figure 7 C tape leader & trailer dimensions trailer 16 0 mm minimum carrier t ape end start rou nd sp rock et holes el ongated spro ck et holes ( 32 mm tape and wi de r) t op co ve r t ape top c ove r t ape p unche d carrier 8 mm & 12 mm only e mboss ed carrier components 100 mm minimum leader 400 mm minimum figure 8 C maximum camber carrier tape round sprocket holes 1 mm ma ximum , either direction straight edge 250 mm elongated sprocket holes (32 mm & wider ta pe s) surface mount multilayer ceramic chip capacitors (smd mlccs) flexible termination system (ft-cap), u2j dielectric, 10 - 50 vdc (commercial grade) preliminary data sheet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c10 87_u2j_ft-cap_smd ? 6/7/2016 19 kemet corporation world headquarters 2835 kemet way simpsonville, sc 29681 mailing address: p.o. box 5928 greenville, sc 29606 www.kemet.com tel: 864-963-6300 fax: 864-963-6521 corporate off ces fort lauderdale, fl tel: 954-766-2800 north america northeast wilmington, ma tel: 978-658-1663 southeast lake mary, fl tel: 407-855-8886 central novi, mi tel: 248-994-1030 irving, tx tel: 972-915-6041 west milpitas, ca tel: 408-433-9950 mexico guadalajara, jalisco tel: 52-33-3123-2141 europe southern europe sasso marconi, italy tel: 39-051-939111 skopje, macedonia tel: 389-2-55-14-623 central europe landsberg, germany tel: 49-8191-3350800 kamen, germany tel: 49-2307-438110 northern europe wyboston, united kingdom tel: 44-1480-273082 espoo, finland tel: 358-9-5406-5000 asia northeast asia hong kong tel: 852-2305-1168 shenzhen, china tel: 86-755-2518-1306 beijing, china tel: 86-10-5877-1075 shanghai, china tel: 86-21-6447-0707 seoul, south korea tel: 82-2-6294-0550 taipei, taiwan tel: 886-2-27528585 southeast asia singapore tel: 65-6701-8033 penang, malaysia tel: 60-4-6430200 bangalore, india tel: 91-806-53-76817 note: kemet reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. kemet does not assume any responsibility for infringement that might result from the use of kemet capacitors in potential circuit designs. kemet is a registered trademark of kemet electronics corporation. surface mount multilayer ceramic chip capacitors (smd mlccs) flexible termination system (ft-cap), u2j dielectric, 10 - 50 vdc (commercial grade) preliminary data sheet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c10 87_u2j_ft-cap_smd ? 6/7/2016 20 disclaimer all product specif cations, statements, information and data (collectively, the information) in this datasheet are subject to change. the customer is responsible for checking and verifying the extent to which the information contained in this publication is applicable to an order at the time the order is placed. all information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. statements of suitability for certain applications are based on kemet electronics corporations (kemet) knowledge of typical operating conditions for such applications, but are not intended to constitute C and kemet specif cally disclaims C any warranty concerning suitability for a specif c customer application or use. the information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. any technical advice inferred from this information or otherwise provided by kemet with reference to the use of kemets products is given gratis, and kemet assumes no obligation or liability for the advice given or results obtained. although kemet designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. although all productCrelated warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. surface mount multilayer ceramic chip capacitors (smd mlccs) flexible termination system (ft-cap), u2j dielectric, 10 - 50 vdc (commercial grade) preliminary data sheet

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